Chip Gallery LDPC

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Designers:

Engling Yeo

Tapeout:

ST 130nm, January 2003

Description:

A 4092-bit low-density parity-check decoder, based on staggered decoding schedule, is implemented in a 130nm 6M CMOS technology. The rate 0.75 code is based on finitefield geometries. Serial, shift-register based architecture enables a compact decoder implementation. The chip has a 4.0mm2 core and operates at 1.1 GHz with 1.2V supply, resulting in a throughput of 1.1Gb/s per iteration.